Why Thermal Metrology Must Evolve for Next-Generation Semiconductors
IEEE Spectrum AI
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AI Hardware
AI Business
An in-depth examination of how rising power density, 3D integration, and novel materials are outpacing legacy thermal measurement - and what advanced metrology must deliver. What Attendees will Learn Why heat is now the dominant constraint on semiconductor scaling - Explore how heterogeneous integration, 3D stacking, and AI-driven power density have shifted the primary bottleneck from lithography to thermal management, with heat flux projections exceeding 1,000 W/cm² for next-generation accelerators.