TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun (Reuters)
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Reuters: TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun - Taiwan Semiconductor Manufacturing Co (2330. TW) plans to open a chip packaging plant in Arizona by 2029, an executive told Reuters.