AI RESEARCH
Virtual Sensing for Solder Layer Degradation and Temperature Monitoring in IGBT Modules
arXiv CS.LG
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ArXi:2508.10515v2 Announce Type: replace-cross Monitoring the degradation state of Insulated Gate Bipolar Transistor (IGBT) modules is essential for ensuring the reliability and longevity of power electronic systems, especially in safety-critical and high-performance applications. However, direct measurement of key degradation indicators - such as junction temperature, solder fatigue or delamination - remains challenging due to the physical inaccessibility of internal components and the harsh environment.