AI RESEARCH
2D-ThermAl: Physics-Informed Framework for Thermal Analysis of Circuits using Generative AI
arXiv CS.LG
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ArXi:2512.01163v2 Announce Type: replace Thermal analysis is increasingly critical in modern integrated circuits, where non-uniform power dissipation and high transistor densities can cause rapid temperature spikes and reliability concerns. Traditional methods, such as FEM-based simulations offer high accuracy but computationally prohibitive for early-stage design, often requiring multiple iterative redesign cycles to resolve late-stage thermal failures.