AI RESEARCH
Full-chip CMP modelling based on Fully Convolutional Network leveraging White Light Interferometry
arXiv CS.LG
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ArXi:2605.05062v1 Announce Type: new As time-to-market is crucial in the Integrated Circuit (IC) industry, speeding up layout manufacturability verifi-cation is essential. Chemical-Mechanical Polishing (CMP) plays a vital role in IC fabrication but is significantly influenced by Layout-Dependent Effects (LDE). An accurate and efficient CMP model enables design teams to correct surface unevenness before fabrication, reducing costs and accelerating the design phase.